DISC Internship Partners
If your company is interested in supporting a DISC Scholar on your projects, please email disc@pdx.edu.
AMS-OSRAM USA INC.
ams-OSRAM USA Inc. is focused on research and development leading to the manufacture of next-generation materials for photonics applications. The site in Hillsboro, Oregon, ~14 miles from PSU, is dedicated to research, development and industrialization of quantum dot nanomaterials. These efforts include a unique product and technology portfolio for sensing, illumination, and visualization from high-performance LEDs and lasers to mixed-signal analog ICs and sensors. They anticipate internship opportunities to be available in the areas of chemical synthesis, optical characterization, and processing of nanomaterials for reliability testing, at both material and photonic device levels. Activities at the site encompass work from fundamental research to product based R&D up to and including industrialization of these cutting edge nanotechnologies. ams-OSRAM anticipates placing at least 1 intern per year, and likely growing in numbers each year during the project period.
MOSES LAKE INDUSTRIES (MLI)
Moses Lake Industries (MLI) provides chemicals used in the manufacturing of semiconductor devices. Electrodeposition of metal interconnects is in our business portfolio, with active, ongoing R&D. We anticipate that the DISC program intern(s) will work in this area studying the deposition process, e.g., copper electroplating, as well as the analytical measurement of the resulting metallurgical properties, e.g., film stress. Moses Lake Industries anticipates placing 1-2 interns per year during the project period.
SIEMENS EDA
Siemens EDA is a broad line supplier of Electronic Design Automation (EDA) tools. It provides a complete semiconductor design flow that includes simulation, emulation, place and route, verification, design for manufacturing, and test. It also develops tools for wire harness systems and computational fluid dynamics. The DISC Scholar interns may be working on projects related to the Calibre product line. Tasks may vary across product management, including Research & Development (R&D) and Quality Assurance (QA) roles. Calibre is the industry leader for IC verification and addressing key challenges in the GDSII-to-mask flow. Siemens EDA anticipates placing at least 1 intern per year, and likely growing in numbers each year during the project period.
ANDES TECHNOLOGY
Andes Technology is a supplier of 32/64-bit embedded Central Processing Unit (CPU) cores and a founding premier member of RISC-V International. It focuses on the embedded market and delivers CPU cores with an integrated development environment and associated software and hardware for System-on-Chip (SoC) development. Andes Technology has a design center in Tigard, OR, located 10 miles from PSU. The company has more than 150 partners, including foundries. The Tigard design center is led by semiconductor experts with over 25 years of industry experience. Under their tutelage, interns may be introduced to RISC-V CPU architecture concepts and engineering best practices, and may develop hands-on skills including hardware design, Universal Verification Methodology (UVM), and software development. Assignments demand both creativity and application of newfound skills. Alumni may expect a promising career in technology fields such as hardware/software and CPU/Artificial Intelligence (AI) development. Andes Technology anticipates hosting a minimum of 1 DISC Scholar per year, and as many as 3 DISC Scholar interns per year.
INTEL
Intel is a global leader in the design and fabrication of silicon-based computer chips. There are four Intel campuses with over 22,000 employees within 17 miles of PSU, including two sites accessible from PSU by high frequency public transportation. The Gordon Moore Park Campus is home to the following research and development groups. Intel's Technology Development group leads its global research and development efforts. The Components Research group invents, develops and demonstrates revolutionary process and packaging technologies to continue to advance Moore's Law. The Logic Technology Development (LTD) group delivers programs to ramp up new process nodes and supports high volume manufacturing led by the LTD Manufacturing group at the world-class D1 factory at Intel’s Hillsboro campus. The Assembly Test Technology Development group designs and delivers packaging and test solutions for Intel products and foundry customers, enabling world-class technologies leveraging an increasingly heterogeneous chip architecture.