Profile

Office: Room 301N Engineering Building

Phone: 503-725-8149

Email: lemmy@cecs.pdx.edu

Personal Web Page: http://www.me.pdx.edu/~lemmy

Position: Associate Professor of Mechanical and Materials Engineering

Professional Summary:

• Materials Science Group Education:
  BSME, 1978, University of Dar-es-Salam, Tanzania
  Ph.D. Mechanical Engineering, 1988, Carelton University, Ottawa Technical Specialties:
  Numerical modeling and simulation of thermal-mechanical behavior of materials processes; micro manufacturing of MEMS devices; reliability issues in electronic packages.
• Professional Society Memberships:
  American Society of Mechanical Engineers (ASME International)
  American Society for Materials (ASM International)
  American Society for Engineering Education (ASEE)
• Experience summary:
  Dr. Meekisho’s research and teaching focus as a faculty member of the Oregon Graduate Institute of Science and Technology (OGI was on modeling of materials science and engineering processes at the macro scale. Most of his published works are at this scale. About twelve years ago, he developed an interest in micro scale materials, devices and manufacturing. In the process, he successfully supervised several PhD dissertations and MSc theses as well as publishing works in the Journal of Heat Transfer and the Journal of Electronic Packaging. He has developed and taught courses in MEMS and Microsystems for senior undergraduates and graduate students. He has been an active organizer and chair of technical sessions on MEMS, modeling of micro and nano heat transfer in the capacity of member of the K-16 (Electronic and Photonic Packaging) Committee of the ASME, 2000 – present. He has been a member of the faculty of the Mechanical and Materials Engineering at PSU since July 1999.
• Selected Publications:
  X. Lu, L. Meekisho, “On the dimensional sensitivity of Quad Flat no lead (QFN) electronic Packages” to be submitted to the Journal of Electronic Packaging, 2010.
  Ravi Chandra Sikakollu, Lemmy Meekisho, Andres LaRosa, “Coupled Field Analyses in MEMS with Finite Element Analysis”, Journal of Heat Transfer, vol. 127, January, pp 34-37, 2005.
  L. Meekisho, B. Hernández-Morales, J.S. Téllez-Martínez, X. Chen, “Computer-Aided Cooling Curve Analysis using WinProbe”, Int. Journal of Materials and Product Technology, Vol. 24, No.1-4, pp 155-169, 2005.
  L.L. Meekisho, K.N. Owusu, “Interfacial Bond Stress Relationship for Gull wing Solder Joints”, Journal of Electronic Packaging, Vol. 126, No. 1, pp 52-56, March, 2004.
  L.L. Meekisho, K.N. Owusu, “Optimum gullwing fillet solder joint subjected to thermomechanical forces”, Journal of Electronic Packaging, Vol. 126, No. 1, March, pp 57-59, 2004.