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Thermo Fisher Scientific Helios G4 UXe Analytical Dual Beam Plasma FIB
A 2021 press release announcing the arrival of the plasma FIB to PSU's campus highlights its unique capabilities.
Key Features and Attachments
- Multichem GIS with Pt, W, C, IEEE, DX, SCM gasses installed
- Easy lift EX Nano Manipulator
- Elstar UC+ Extreme High Resolution electron column
- Plasma Focused Ion Beam 2.0 Column
- Charge neutralizer
- Electron Beam Deceleration
- Imaging detectors STEM 3+, In lens TLD with SE and BSD, ET SED, ICE, retractable BSD, CCD IR, in chamber nav cam
- Oxford Instruments Ultim Max 100mm Energy-Dispersive X-ray Spectroscopy (EDS)
- Oxford Instruments Symmetry Electron Backscatter Diffraction (EBSD)
- Oxford Instruments Aztec and Crystal software
- Slice and View version 4 for 3d reconstruction
- Maps 3 tiling, stitching and correlative workflow software
- Spin and rocking milling
- Cryo cleaner and Plasma cleaner
Typical Applications
- XHR imaging and dimensional metrology of specimen features
- Site-specific x-sections for SEM, STEM and TEM sample preparation
- Low voltage STEM imaging with EDS and EBSD spectroscopy
- EBSD sample preparation
- In-situ lift out
- In-situ EDS, bulk and transmission EBSD analysis of hard-to-prepare or access specimen
- Image and spectroscopic tomography
- Materials pathfinding
- Failure analysis
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Zeiss Sigma Variable Pressure High-Resolution Analytical Scanning Electron Microscope
A variable pressure field emission SEM equipped with Oxford Instruments EDS/WDS and EBSD detectors. 1.3-nm imaging resolution is achievable at 20kV and 2nm at 5kV. The microscope is ideal for organic and inorganic materials, geology, biological samples with a capability of elemental composition analysis, Kikuchi diffraction crystallography and comprehensive pattern generation.
Key Features and Attachments
- Gemini electron column with Schottky FEG
- Imaging detectors, In Lens, ET SE, VP SE, 5 segment BSD, SCD, IR CCD
- Variable Pressure charge compensation to 120 pa
- Oxford Instruments Ultim Max 65mm Energy-Dispersive x-ray Spectroscopy (EDS) (with duck bill collimator)
- Oxford Instruments Symmetry Electron Backscatter Diffraction (EBSD)
- Oxford Instruments Aztec and Crystal software with Large Area Mapping, Layer Probe, Feature
- Wavelength-Dispersive x-ray Spectroscopy (WDS) Note: WDS is used only with special approval on inca software since we have limited standards
- Raith high-speed electrostatic beam blanker
- Nanometer Pattern Generation System (NPGS) for electron beam lithography
- HT: 100V~30kV
- Resolution: 1.3nm
- Vacuum: Low / High vacuum
- Magnification: 30x~1,000,000x
- Tilt: -2° to +90°
- Rotation: 0 to 360 degree
Typical Applications
- SE/VPSE/in lens SE/multi-segment BSE imaging
- Dimensional metrology
- EDX/WDX composition analysis
- FSD imaging and EBSD analysis
- Simultaneous montage imaging and spectroscopy for Large Area Mapping to several cm2 scale
- E-beam lithography
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Rigaku Ultima IV X-ray Diffraction System
For powder and thin film X-ray diffraction, SAXS, pole figure, residual stress and other X-ray analyses. See the application gallery for this instrument at https://www.rigaku.com/fr/products/xrd/ultima.
The Ultima IV X-ray diffraction system is a multipurpose θ-θ diffractometer with a 3 kW Cu X-ray tube, a CCD camera detector, independent θ-θ geometry, and cross-beam optics (CBO), which allow measurements in either focused beam or parallel beam geometries, depending on the measurement type and sample characteristics. We have several stages and attachments that allow a variety of X-ray diffraction, scattering, and reflectivity experiments to be performed.
Typical Applications
- Wide-angle X-ray diffraction
- Composition determination
- Percent purity
- Quantitative pattern refinement/fitting
- Percent crystallinity
- Particle size based on line broadening
- Analysis of strain and residual stress
- Grazing incidence and thin-film X-ray diffraction
- Parallel beam geometry enabled by cross-beam optics allows for X-ray diffraction measurement of thin film samples deposited on substrates
- Small-angle X-ray scattering (SAXS)
- Particle, pore, grain, or hard segment size determination
- X-ray reflectivity (XRR)
- Film thickness determination
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Transmission Electron Microscopy Simulator
Key Features and Attachments
Most universities offer theory-only Transmission Electron Microscopy classes. Cost and access to advanced research instrumentation limit hands-on teaching opportunities at all universities. Realizing we could expand teaching opportunities, CEMN developed perhaps the most sophisticated Transmission Electron Microscope simulator in existence. Our simulator at e-microscopy.org is used by other universities and Thermo Fisher Scientific as a teaching tool. As we move to CEMN v2.0, there is a plan to simulate other research instrumentation to expand metrology teaching opportunities.
Our TEM simulator is based on the FEI / Thermofisher Scientific Tecnai user interface. Specifically, we modeled a 200kV FEG TEM, model F20 with super twin lens, Gatan STEM, and Oxford Instruments X-Maxn EDS running on Aztec software. Several universities and some private individuals have used this simulator to teach or learn basic TEM operations, for example column alignments, imaging, and EDS.
Within the user interface, there is a hidden feature that will change the user interface to a limited version of the FEI / Thermofisher Scientific Titan. If you contact us, we may be willing to share how to access this feature.
People wishing to use the simulator for monetary gain will need a license issued by PSU's Office of Innovation and Intellectual Property.
Simulator development was funded by CEMN, Keck Foundation and Thermo Fisher Scientific.
Typical Applications
Teaching or learning TEM operations
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Veeco Dektak 150 Profilometer
Accurate and repeatable step height and texture measurements. Although theoretically capable of angstrom resolution height measurements, few substrates are sufficiently flat and smooth enough to realize angstrom measurements. Typically we can pick up a step of a few nm on polished single crystal silicon wafers. Typically coatings on microscope slides need to have about 10 nm steps.
Key Features
- 8-inch wafer compatible
- Maximum scan length 6 inches
- 12.5 μm stylus
- Height resolution about 1 nm
Typical Applications
- Measurements of thin film coating thickness, roughness and film stress analysis
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Nicolet iS10 FT-IR 10 FTIR spectrometer with Smart iTX (diamond ATR) and Smart OMNI-Transmission adapters
Key Features
- OMNI-Transmission and Smart iTX diamond Attenuated Total Reflectance accessories for compositional analysis of liquids and solids
- HeNe Laser
- Spectral range 400-4000 cm-1
- Spectral resolution better than 0.4 cm-1
Typical Applications
Compositional and functional group analysis of liquids and solids, chemical analysis and identification, chemical purity, forensics, gemstone analysis, polymers and plastics analysis, QA/QC processes, etc.
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Quantachrome Nova 2200e
The instrument offers single and multipoint BET surface area analysis, pore size and volume analysis for solid materials.
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Ultramicrotome
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RMC PT-XL Cryo-Ultramicrotome
The ultramicrotome is designed for ultrathin sectioning histological or polymer TEM samples as thin as 60~120 nm at room or cryo temperature.
- Specimen thickness: 60~120 nm
- Cutting speed: 0.1-49.9 mm/s
- Application: polymers, animal and plant tissues TEM sample preparation
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Retired Instruments
- FEI Tecnai F20 S/TEM with GIF, EDS
- JEOL 2000 FX S/TEM with EDS
- JEOL 100CX TEM
- FEI XL30 Sirion SEM with EDS and EBSD
- FEI Strata DB-237 with Omniprobe 200 and EDS
- FEI Helios Nanolab 400S with Omniprobe 200
- PHI Versaprobe XPS/UPS/AES
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